Provided are a luminescent material and a preparing method thereof. Such a method may include providing a first overlay pattern on the workpiece and a second overlay pattern over the first overlay pattern. The system also includes a storage module communicating with the compute module and storing the guest data. This bearing has at least two bearing surfaces separated differently from the fastening section and arranged on different sides of the connecting element, so that the separated section of the connecting element can tilt in the bearing after the ignition of the pyrotechnic charge. The semiconductor chip, wire and inner leads may be subjected to a molding process, and the connecting bar which connects the tip terminals of the inner leads may be cut so as to independently separate each of the inner leads from the die pad.