Disclosed are methods for facilitating concurrent formation of copper vias and memory element structures. ICs that pass testing are sorted according to an operating parameter, in other words binned, and placed in the appropriate segregated area. In one approach, markup language documents are compiled. The male socket is configured to interface with the female socket, regardless of orientation of the male socket with respect to the female socket. A specimen identification unit specifies the specimen based on the waveform of the receiving signal within the frequency band.