A packaging substrate includes a semiconductor interposer and at least one other intermediate substrate, e. The oxide semiconductor material having p-type conductivity can be provided using a molybdenum oxide material containing molybdenum oxide ) having an intermediate composition between molybdenum dioxide and molybdenum trioxide. The supporting clip comprises a body and a support extending from the body. A swinging end of the second link member 5 is swingably connected to the fourth link member 7 on a third connecting axis J7.