An apparatus and method for inspecting a film carrier tape for mounting electronic component, in which film carrier tapes for mounting electronic component provided with a plurality of electronic component mounting portions in multiple strips in a transverse direction are exactly used and which can be inspected simultaneously, so that inspection efficiency can be greatly enhanced. The method includes forming the triple layer composed of an insulation layer formed over an exposed surface of the silicon microstructure, a conductive layer formed over the entire insulation layer, and a metal layer formed over a top portion of the microstructure; and partially etching the conductive layer to form electrical isolation between parts of the microstructure. At least one of the base and the carriage assembly is movable vertically towards the other of the base and the carriage assembly.