This table for a chopper folding device comprises a surface for application of products to be folded, the application surface extending along an application plane, a folding opening suitable for the passage of the products to be folded, at least one first guide portion disposed adjacent to the folding opening and comprising a first guide surface inclined with respect to application plane. The IC chip on panel is mounted in the edge area, along one side of the panel substrate of the electro-optical panel. An asynchronous request to fill selected buffers of a plurality of buffers is sent. A heat radiation member is provided at the opposite side of the electro-optical panel. The slider is positioned to close a substantial portion of the strips, and then an end stop, docking station, and corner seal are formed against a sealing plate. The optical confinement of the primary mode is not substantially reduced.