A motor vehicle body with a front hood, a front window rising from a rear edge of the front hood, and an elongated cross member is provided. The insulative housing has a top surface for receiving a land grid array package. Alternately, the housing can be evacuated with a vacuum to maintain a clean operating environment. An encapsulant is deposited over the substrate and a first surface of the first semiconductor die. The first door is coupled to the first segment and the second door is coupled to the second segment.