An improved method for lapping the opposed major surfaces of a wafer is provided. A photomask assembly includes a pellicle assembly formed from a pellicle frame and a pellicle film coupled to a first surface of the pellicle frame. These rivets form individual metal islands with numerous undercuts, around which there is a continuous ceramic network. The master server determines which of the plurality of element management servers are to manage each of a set of one or more network elements. The thin-film polymer may have a low dielectric constant and a high porous surface area.