An optical semiconductor package includes an optical semiconductor component, a front face of which has an optical sensor, and encapsulation defining a cavity in which the optical component is placed and having external electrical connection of this optical semiconductor component. A shoulder portion extends upward and axially inward above an upper margin of the side wall to a finish defining an opening adapted to accept a closure. A bottom of the enclosure has a relatively low reflectivity interior surface. One or more of the frame members may serve as a receiving chamber for supply of a quench medium to an induction heated workpiece positioned in an opening in the inductor.