Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packagescomponents are controlled to facilitate management of the package stresses. The shaft has a first end and a second end and the cam is movably disposed at the first end and has an inclined plane facing the second end. Detonation starts with a first segment in the detonation train which is produced under the lowest compaction pressure, and then detonation progresses to a last segment compacted under a higher compaction pressure.