The present invention intends to provide a thermoplastic resin foam molding comprising a substrate having a foam layer and a projection formed in one piece together with the substrate wherein the projection hardly separates from the substrate and they are firmly jointed together. The catalyst can be formed by at least tin and indium in addition to cobalt or nickel. The software may include homogeneous agent software, one or more library dynamic-link libraries, and the like. Therefore, a viscosity-controllable conductive ink composition is obtained.