The present invention provides an aqueous dispersion for chemical mechanical polishing suitable for polishing of copper, which has a high polishing speed and a low erosion rate with overpolishing. The platform members have a generally rectangular body with at least one side of each platform member formed as an extending finger portion. Storing the row address also guides repair using segmented redundancy. If the low power mode is determined, the configuration memory is loaded with low power mode configuration data for the circuit block. A depthpressure sensor may be included.