A method is disclosed for fabricating an LED The method includes providing an LED chip having an epitaxial region comprising at least a p-type layer and an n-type layer, an ohmic contact formed on at least one of the p-type layer or the n-type layer, and a bond pad formed on the ohmic contact. The bandage includes a base having a preformed recess, with a humectant-containing gel within the recess. A burner tip is mounted on the downstream end of the burner tube adjacent a first opening in the furnace, so that combustion of the fuel gas takes place downstream of said burner tip. The second element is disposed on the base, wherein the second element is movably disposed relative to the first element along the first direction and movably disposed relative to the base along the first direction and the second direction. A trim angle is adjusted automatically in at least one operating range, via a closed control loop, with detection of preset regulating parameters and is automatically controlled, in at least one other operating range, with detection of preset control parameters in a manner established for the operating range.