Gate structures and methods of manufacturing is disclosed. A tracking signal supplied by the inner loop to the integrating controller of the outer loop is used to avoid windup problems when the transmitted power is saturated. The identified positional information is used to selectively modify at least one predefined channel parameter, for example, to provide enhanced track following and enhanced data recovery. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die. In one embodiment, the common electrode and the transparent electrode are formed in the same substrate, and in another embodiment, the common electrode and the transparent electrode are formed in different substrates.