A contact structure for semiconductor devices which are integrated on a semiconductor layer is provided. To determine first and second products, a first weight of a first software architecture is multiplied by weights of first requirements of a service and a second weight of a second software architecture is multiplied by weights of second requirements of the service. The method further includes encoding by the processing module, a plurality of rows of video data associated with the picture upon determining that the picture is to be encoded, wherein the plurality of rows are encoded based on a pre-selected maximum encoded picture size.