A laser processing apparatus removes a sapphire substrate from an optical device wafer configured by forming an optical device layer on the front side of the sapphire substrate through a buffer layer. The second sensing layer has at least one second sparse sensing zone and at least one second dense sensing zone. An alternative presentation or presentations for the survey can be derived such that the measurement error is reduced. The inner insulator and the outer conductor and the jacket are placed at an outer side of the center conductor in an order of the inner insulator, the outer conductor, and the jacket. In order to offer an increased safety standard with a simple structure and to meet safety stipulations with respect to the speed-dependent allowability of emergency unlocking, the actions applied by the emergency unlocking means to the trunk lock and the catch means are decoupled from one another.