A method for forming through-wafer interconnects in a substrate of a thickness in excess of that of a semiconductor die such as a semiconductor wafer. Guiding slots on the sliding plate rotate a transmission bar. The LCD device determines driving voltages such that for each of a high voltage or a low voltage during these 2N frames, the number of applying positive voltages is the same as the number of applying negative voltages where a unit period is 2N frames for multi-gray-level display of levels. The cable protection cover forms a protective barrier with the cover shroud in a closed position preventing the one or more cables from being disconnected from the interface.