A secondary drying process is disclosed for removing residual solvent from drug-containing particles that have been formed by solvent-based processes, the secondary drying process utilizing a combination of vacuum, agitation, and a stripping gas. Sensor means are provided between said body with the seat for engagement with the union and said locking means, said sensors detecting the relative position of the said locking means with respect to the body and emitting a corresponding signal. A plurality of stacked conductive bumps are formed on the first contact pad. It refers to a preferential etching at the semiconductor-barrier layer interface. The protein array elements may be attached directly to a organic functionalized mirrored substrate by a binding reaction between functional groups on the substrate and protein.