Diimide-based semiconductor materials are provided with processes for preparing the same. Initially, a secure communication mode of communication is enabled at a first computer without a user entering any cryptographic information for establishing the secure communication mode of communication. Alternatively, the body member may be constructed from a highly thermally conductive material such that heat energy is transmitted through the body from the tissue located proximate the body member and into a heat sink. The composition may also include ancillary ingredients such as viscosity controlling agents, defoamers, coloring agents and the like.