A method of fabricating a semiconductor device is disclosed. The specific BCC schemes described include 5-to-2, 6-to-5, 7-to-5, 6. A connector assembly is included on the body for removably mounting the body on the housing. A plurality of hooks are at the second region, the hooks having a vessel penetrating tip and a width greater than the width of the strut from which it extends such that the penetrating tip portion of the hook extends beyond the first wall. Additional steps may include providing on non-volatile memory a combined operating system for both a smartphone and the automated external defibrillator such that the combined operating system auto loads upon starting the device after connection of the smartphone to the case inputoutput port. Sensing devices may be shared between the first and second photosensitive diodes.