Various circuit techniques for implementing ultra high speed circuits use current-controlled CMOS logic with inductive broadbanding fabricated in conventional CMOS process technology. The aluminum layers are arranged to surround the copper layer of the uppermost aluminum layer being the upper aluminum layer being thinner than the lower aluminum layer and having a slightly smaller diameter than the copper and aluminum layer. In certain embodiments, the sleeve or wrap includes a body with a lumen, wherein the body is configured for holding andor containing the container.