An apparatus for interfacing an integrated circuit with external circuitry includes a transistor having an emitter coupled to a node for receiving a control current from the integrated circuit. The lead 12 of the insulation displacement terminal 3 is soldered to the first surface 10a of the circuit board 10 through the bottom plate 13 of the main housing 6 and the circuit board 10, which is held in the second retaining space 11 between the main housing 6 and second cover housing 8. The retainer sleeve slides over said centering member and is glued to the centering member and the housing of the video chip. The metal is then formed on the barrier layer.