An electrostatic chuck having an essentially flat film electrode which is essentially parallel to the chucking surface of the electrostatic chuck is fabricated by depositing a film electrode, preferably by screen printing, onto a surface of a sintered ceramic substrate. A conductive material or an insulating material is adhered on the modified surface by discharging it, or the like to form a conductive layer and an insulating layer. The casing member receives the impeller, and the casing member defines therein a pump passage configured to have an arcuate shape along the vane grooves.