Techniques are described that provide uplink power control techniques that can support different uplink multi-input multi-output transmission schemes. Each of the oxide semiconductor layers is in contact with part of each of an upper surface, a lower surface, and a side surface of one of the end portions of the oxide semiconductor layer and part of an upper surface of the gate insulating layer. The apparatus also indicates the appropriate teardrop outbound course and parallel intercept course, as well as providing instant reciprocal headings and a DME Arc aid. Points are assigned to the pipe segments based on the presence of the water quality factors and service interruption factors. The second filtering circuit is connected between the power source and the second power supply pin to filter the power provided to second power supply pin of the video card chipset. The bed frame assembly removably attaches to the outer surface of the longitudinal members of a bed frame to conceal exposed bed frame members and provide a more pleasant, customized view of an entire sleep structure.