A method of forming a bump on a substrate such as a semiconductor wafer or flip chip. Using these techniques, it is possible to screen libraries without labeling either the target antiligand or ligand. For each symbol in the sequence, the method further comprises determining a set of state metrics, each representing a probability that the respective symbol corresponds to the plurality of states. The detection circuit detects the voltage of one terminal of the memory cell based on a first detection timing, and further, detects the voltage of one terminal of the memory cell based on a second detection timing. Additionally, because the semiconductor device is directly attached to the lead frame, power dissipation, i.