According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. The pulse tube cooler also includes a regenerator, a heat exchanger and a pulse tube, another heat exchanger and an expander all sized for an optimal operation. When the shaped charge is used in a perforating gun, reactive powder materials may be added to the plurality of portions of the liner to optimize the penetration or the enhancement of the perforating tunnel.