The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol % or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition. The indicator may include a plurality of layers wherein each of the layers includes a membrane. Since the suspension board with circuit and the first wired circuit board are rendered substantially identical in layer structure, both characteristic impedances at these connection points can be matched. Supports for the reflective surface have parabolic cutouts in the top portion and are processed as multiple side by side components in a corrugating machine. For each abutting pair of occurrences of the tile representations in the arrayed placement, the connection representations are determined that terminate at a shared portion of the boundaries of the tile representations of the abutting pair.