A vibration tolerant electronic assembly may include a base and a first isolation stage including a first frame, at least one first linear bearing coupling the first frame to the base to constrain movement of the first frame along a first coordinate axis, and at least one first damper for damping movement of the first frame. The placement of the cap on the device chip is sealed using a gasket having treaded surface for improved adhesion, cold weld deformation of gold, and decreased susceptibility to foreign particles resulting in a superior seal. Since the dust-generation suppressing function is based on the fabric end structure formed of yarn loops, the wiper can be produced while eliminating fusion-bonding or an adhesion treatment of the cut face of the fabric. An algorithm employing default scores is then utilized to refine the top-n prediction list to insert items with default scores above an inclusion threshold set by a last item in the top-n prediction list. At normal operating conditions, the current in the device flows through the Schottky contacts.