Apparatuses and methods for an improved semiconductor layout are described herein. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding. The security processor is coupled to one of the peers via a channel that is separate from the channel carrying the encrypted communications between the peers. This provides the maximum utilization of the adsorption capacity corresponding to the adsorbent being in equilibrium with the high initial concentration of the contaminant in distinction from the low utilization when adsorbent works in equilibrium with the low output concentration. The snap ring is mounted to the optical cable holder so as to retain the optical cable holder to the body.