The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls. The semiconductor device according to the present invention has a semiconductor element including pad electrodes formed on the electrode area thereof, a first insulation layer formed on the circuit formation area of the semiconductor element, and a first circuit pattern formed on said first insulation layer. A system controller may also be used to control at least one of the radio node and the controller node. MFDAT provides a \u201cvirtual\u201d system to the technician whereby when a second system under test is unavailable, a previous good reading stored by MFDAT is available for comparison.