A semiconductor device is provided which is capable of reducing the number of masking processes in forming contact holes. Each LiDAR data point is tested to determine if it lies within the value of a closed surface defined for higher LiDAR points. In an other aspect a drive system and a machine are provided. The periodic waveform of the mains supply voltage is used to establish the timings of the duty cycle modulated signal. The super absorbent polymer particle are bonded to the sheet with an adhesive that is applied in a continuous plane to the entire surface or the substantially entire surface at least at the portion to be provided with the super absorbent polymer particle in this sheet. Depending upon the specific embodiment, the device has a plurality of photovoltaic regions numbered from 1 through N respectively bonded onto the plurality of first bonding sites numbered from 1 through N and second bonding sites numbered from 1 through N.