A highly durable touch panel is provided. The converted content data is transmitted to the terminal. A first reel having the film wound thereon and a second reel for receiving the film fed from the first reel are included. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. In some illustrative embodiments, two or more depositionetch cycles may be used, thereby providing the possibility to select reduced target values for the barrier thickness in the die regions, while also obtaining a significantly reduced thickness in the bevel region. The foil may be adhered to a printed circuit board sub-structure and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density.