Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. Warping is executed using a continuous warp contour lacking spatial discontinuities which does not invert or overly distend the positions of adjacent end points in adjacent frames. In use, the preformed, shaped biopolymeric materials may be applied to tissue in need of repair and then sealed around its edges with a liquid bioadhesive.