Innovative new methods in connection with lighter-than-air free floating platforms, of facilitating legal transmitter operation, platform flight termination when appropriate, environmentally acceptable landing, and recovery of these devices are provided. By the process of the present invention, a problem of redeposition of copper on the sidewall of a via hole in the argon sputtering and a problem of an etching process of the organic insulating film in the hydrogen plasma treatment can be solved, thus realizing excellent cleaning of the bottom portion of the via hole. The system can be trained to recognize the items using images taken of the items. In addition, the apparatus includes sealing means capable of providing fluid tight pressure chambers between the expansion swages and an expanded portion of the tubular. At least one electron-conductive intermediate layer is provided between the electrode-side electrical insulating layer and the adjacent solid electrolyte. The accelerator may be implemented in various forms, including hardware, software, andor machine-readable media.