A Fizeau interferometer apparatus is used for both low and high interference measurement. A bonding layer is placed between the substrate and the semiconductor IC to accomplish adhesion therebetween. Each of the plurality of compensating output buffers is configured to respectively receive one of the compensating starting signals and respectively output a compensating signal, wherein, each compensating output buffer receives the first buffered voltage as power. The player is invited to freely select the card to be attached to each face of the dice from the hand, and the dice card corresponding to an appearing face is used as the battle card. An electric characteristic lowering problem can be prevented by forming the coil on the cylindrical body, and transforming the cylindrical body into a square-shaped body to improve surface mounting.