An embodiment of the present invention discloses a method for the computer-aided determination of the dependencies of a plurality of modules of a technical system, especially of a software system. An exemplary circuit includes first and second copies of a replicated circuit, an input circuit, an output circuit, and a pipelined routing path. If successful, the receiver calculates a checksum for the previously received message and transmits the checksum as a prediction of the remainder of the message to the transmitter. The layers of the laminate are joined at a multitude of spaced-apart bond sites, and the laminate is heat annealed, wherein the fibrous layer forms gathers between spaced-apart bond sites to provide the three dimensional texture and the laminate has a liquid resistant layer to fibrous layer length ratio between about 0. Defect-mapped wafers are transferred to a computer-controlled laser area cleaning station 11 which lifts the defects and sweeps the wafer surface clean, except for stubborn defects. Morphological region growing is performed on the selected seed regions.