This invention relates to a copper thick film paste composition paste comprising copper powder, a Pb-free, Bi-free and Cd-free borosilicate glass frit, a component selected from the group consisting of ruthenium-based powder, copper oxide powder and mixtures thereof and an organic vehicle. A semiconductor substrate is provided, and an opening is formed which extends entirely through the substrate. The system additionally includes a rate determiner component that is in communication with the receiver component, wherein the rate determiner component determines the trigger rate for the digital camera based at least in part upon the first data, wherein the trigger rate is indicative of an amount of time between consecutive images captured by the digital camera. Each section is formed as a parallelogram having two acute angles and two obtuse angles. Each petal and portion are tactilely distinguished from an adjacent petal or portion.