A device may include a connector receptacle coupled to a motherboard; a connector hold-down disposed adjacent to the connector receptacle; andor a connector cage coupled to the motherboard and covering the connector receptacle and connector hold-down. According to the process, the substrate is etched to form isolation trenches after which a sidewall oxide layer, a liner nitride layer and a field oxide layer are subsequently formed on the substrate and in the isolation trenches. The laminated structure further includes first power lines to supply a voltage to the first electrode layers and second power wiring electrically connected to the second electrode layer.