A stacked film patterning method is provided which is capable of reliably removing residual substances remaining after etching of a metal film, improving etching uniformity of a silicon film, and preventing an occurrence of etching residues. The chambers are welded together to form columns where at least one column has a filtration chamber. In addition, an image processing system includes at least an image reading unit in addition to such an image processing apparatus and preferably comprises an image forming unit to thereby obtain high picture quality and stable image.