1459945688-a69c3edf-2405-419a-a155-d43100b8b761

A lead-containing glass material of the type suitable for use in a wafer bonding process, wherein the moisture resistance of the glass material is increased by the presence of a lead phosphate coating on an outer exposed surface of the material, thereby acting as a barrier to reaction of moisture with the lead of the glass material. The wireless network system may also include a repeater node having a first and second repeater wireless interfaces, wherein the repeater node is configured to receive the data transmission on the first or second repeater wireless interface and to repeat the data transmission on the other of the first or second repeater wireless interface. A method for manufacturing a color filter substrate comprises forming post spacers on a substrate, forming a black matrix on the resultant substrate formed with the post spacers, and then forming color resin layers on the resultant substrate formed with the post spacers and the black matrix. The branch processing circuitry further includes path address logic that determines a path address of the selected branch prediction.