In one embodiment, the present invention includes a method for depositing a barrier layer on a substrate having a trench, depositing a liner layer on the barrier layer that includes a surface oxide, electrolessly depositing a copper seed layer on the liner layer, where the surface oxide is reduced in-situ in an electroless bath, depositing a bulk metal layer on the copper seed layer. The indicating instrument comprises a meter movement and a circuit board. Further enhancements of the finial design are realized by the finial mold structure, which allows additional supplemental finialsskirts to be connected to the base finial.