A hinge assembly for interconnecting a main body and a cover of a portable electronic device includes a hinge housing, and a first hinge apparatus and a second hinge apparatus rotatably contained in the housing. When this light spot is applied to a micro metal member, plasmon of the micro metal member is excited, and near field light leaks out therefrom. Alternatively, the ultrasonic vibration and the electrical field may be applied simultaneously. The binder has excellent adhesion and thermal bonding characteristics, and thus is useful for an electrochemical device comprising multiply stacked electrochemical cells, and can improve the overall quality of a battery. The stator vane assembly reduces the pressure distortion upstream of the fan outlet stator vanes, reduces the circumferential pressure variation and this reduces blade forced response excitation, noise generation and aerodynamic losses.