A semiconductor device having a multi-level interconnection structure including a plurality of interconnection layers stacked one on another on a semiconductor substrate is provided, and a production method for the semiconductor device. The prosthesis comprises a first endplate assembly for engaging the first vertebral endplate. These feed stocks are useful for a variety of purposes including as gasification and combustion fuels. An account authentication section verifies authenticity of account of the client application, and an information storage section stores the information.