A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The memory cells include a pore region containing a chalcogenide material along with three or more electrical terminals in electrical communication therewith. Recorded interferograms for each image point are then transformed into the spatial frequency domain by Fourier analysis, and the surface height for each corresponding object surface point is obtained by examination of the complex phase as a function of spatial frequency. High level semantic updates to the virtual machine instances are identified and updates associated with a golden master image are tracked. The phosphor particles include a first semiconductor part and a second semiconductor part which covers at least a part of the surface of the first semiconductor part. The return blades have a configuration in which a total cross sectional area of inlet openings of concave paths formed by a plurality of ribs is set to be equal to or larger than a cross sectional area of the suction port, while a total volume of the concave paths is set to be smaller than the total volume of non-path portions excluding the paths.