A method and structure for fabricating an electronic device using an SOI technique that results in formation of a buried oxide layer. The cold packs retain their cold temperature prior to onset of a condition requiring cold therapy relief by the presence of the cold source and the thermally insulating properties of the housing. Openings in the ground plane are located under the components or terminals of the components. A plug and a filler material is located within the enclosed cavity. If an active speech frame is detected, the frame is subjected to a second classifier dedicated to discriminate unvoiced frames.