In a method of manufacturing semiconductor device, an insulating film is provided on a surface of a semiconductor substrate, a porous metal film containing numerous voids is formed on a region of the insulating film, and a protective film is provided on the porous metal film. The needle assembly may be connected to the syringe by the user grasping the needle hub in first and second embodiments, or turning of the needle sheath in other embodiments. 5 to 2 N15 mm, preferably 1 to 1. In the normal mode, the beam of light operates at a selected power level which provides a desired signal to noise ratio. The loadable interprocess communication manager is terminable from the working memory upon lack of a need for communication between threads in different address spaces. The opening is fitted with a valve which may be connected to a drain hose to collect wash water into a collection tank securely positioned on the concrete truck.