A computer-implemented process for a customer to scan items for purchase and proceed to a rapid checkout can be operated within a processor of a portable computerized device. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. The architecture also includes integrated cockpit control panels that employ a printed circuit board to avoid wirecable connections for cockpit control panel components beyond the face panel. The lead frame is therefore free from deformation during lead forming while promoting the miniaturization of the semiconductor devices.