A semiconductor plasma processing apparatus for processing a semiconductor wafer includes a sensor for monitoring at least one processing state of the semiconductor plasma processing apparatus, first and second processing state monitoring units coupled to the sensor, and a selector unit for selecting one of the first and second processing state monitoring units. The transponder reader unit generates signals which correspond to the signals of a magnetic card read head, for the initiation of the magnetic signal evaluation unit. The disposable fluid sample diagnostic devices may include sample chambers with inlet ports, electrical, physical, or chemical sensors, in situ calibration media, a plurality of electrical interface terminals, and temperature control elements. Each of the plurality of assignable resources is assigned to a single one of the plurality of logical partitions.