In a multimode FPA, all of the FPA’s conducting layers including all of the absorbing layers are patterned to form electrically isolated commons for at least two, and in some instances all of the photodetector sub-arrays, to support independent mode biasing of the photodetectors. The shakers are detachably connected by an integrally formed lock assembly. Antifuse-components are connected in series one after another between a power source electrode and an output terminal that is grounded when a MOS transistor is conductive. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.