1459956309-3c3401f5-3325-47d9-998f-4aaf546f3a15

The invention provides a method for manufacturing a semiconductor device with reduced dishing and erosion. Disposed within a central space or opening defined by the frame body is a die paddle including four peripheral edge segments, each adjacent pair of which collectively define a paddle corner. The one or more preferred images may comprise an image of a person presented in an attractive appearance. A latch circuit latches the intermediate clock signal selected by the first phase selector with the clock signal selected by the second phase selector.