A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A foil positioning pattern is formed on a front surface of the substrate, the positioning pattern touching the straight line portion of the semiconductor device to regulate a position of the semiconductor device. The first data detector is operable to perform a data detection process on a first signal derived from a data input to yield a detected output.